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HX-CML6000 Automatic IC Module Glue Laminating Machine
  • HX-CML6000 Automatic IC Module Glue Laminating Machine
  • HX-CML6000 Automatic IC Module Glue Laminating Machine
HX-CML6000 Automatic IC Module Glue Laminating Machine
Main technical parameters:

Voltage:220V 50HZ ;

Total power:1.0KW 

Air source:more than 6kg/cm2 ;

Air consumption:20L/min

Module strip spec:ISO standard module strip(M3&M4 module)

Control method:PLC program + servo system 

Output:10000-12000chips / hour

Weight:400Kg

Bonding method:hot melt glue(e.g. Tesa8410、 Scapa G175 etc)
Dimension:L1700mm X W800mm X H1700mm

Note: Support non-standard customisation of the number of workstations/output/appearance, etc.

Main features:

This machine is automatically controlled by PLC program,and operated by friendly human-computer interface displayer. Incorporating with automatic feeding, hot melt glue stepping laminating, automatic module stripe collecting:Suitable for all kinds of IC module strip glue laminating;

Incorporating IC module strip and hot melt glue convey, rush glue, hot welding glue laminating and finished module stripe collecting.

Reversible welding head structure design, welding head convenient clean and easily replacing. 

Adopt servo motor stepping convey IC module strip and hot melt glue stepping laminating. With adjustable parameter, fast speed and high precision.

IC module stepping position is automatically monitored by photoelectric sensor, machine will automatic alarm and stop when the module position is wrong. 

Can equip with CCD glue laminating testing unit according to customer’s different requirement. Can realize unman operating & auto monitoring.

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