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HX-ACI800 Contactless IC module Pick and Place machine (bulk chip)
  • HX-ACI800 Contactless IC module Pick and Place machine (bulk chip)
  • HX-ACI800 Contactless IC module Pick and Place machine (bulk chip)
HX-ACI800 Contactless IC module Pick and Place machine (bulk chip)

Main technical parameters:

Power source: 220V 50HZ

Total power: 2.0KW

Air Consumption:10L/min

Air source: 6kg/cm2

Material: COB chip in bulk

Output: 3500-4000 chips/hour

Weight: 1200kg

Overall dimension: L1750mm X W1150mm X H1700mm

Note: Support non-standard customisation of the number of workstations/output/appearance, etc.

Main features:

Apply vibrator to arrange COB chips bulk in regulated direction, then use vacuum pump along with servo action system to carry the chips to fixed position( as per different COB chips choose different techniques, namely silk print adhesive sticker in PVC material or paste glue tape on finished antenna implanted PVC sheet). 3X8, 4X8, 5X5 sheet layout available, can be set according to customer different requirements.

The machine applies PLC program control and colorful friendly human-machine interface operating. All module position parameter can be set to make sure chip implanting position precision.

Soft plain desk is convenient for COB chip implanting and avoid chips damaged.

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