The production process of SIM cards mainly includes the following steps:

Raw material preparation: Firstly, it is necessary to prepare the raw materials for producing SIM cards, mainly including plastic substrates and metal contact plates. Plastic substrates are usually made of PVC or PET materials, while metal contact plates are made of copper.

Stamping molding: Place the plastic substrate into a stamping machine and press it into the shape of a SIM card through a mold. This step ensures that the external dimensions and shape of the SIM card comply with the standards.

Built in chip soldering: After stamping, electronic components such as microprocessors and memory need to be soldered onto the metal contact pads of the SIM card. These components typically include CPU, ROM, RAM, EEPROM, and serial communication unit.

Functional testing: After welding is completed, perform functional testing on the SIM card to ensure that it can store and transmit data normally. This step includes checking the read/write speed, storage capacity, etc. of the SIM card.

Packaging: Finally, place the tested SIM card into the packaging bag and seal it. The packaging usually indicates the type, capacity, and other information of the SIM card.

Production equipment and technical requirements for SIM cards:

Stamping machine: used to press plastic substrates into specific shapes.

Welding equipment: used to weld electronic components onto metal contact plates.

Testing equipment: used to test the functionality and performance of SIM cards.

Encapsulation device: used to package SIM cards that have passed testing.

Requirements for the production environment of SIM cards:

Cleanliness: High cleanliness is required during the production process to prevent dust and impurities from affecting the performance of SIM cards.

Temperature and humidity control: The production workshop needs to maintain appropriate temperature and humidity to ensure the normal operation of electronic components.

Anti static measures: Due to the precise electronic components inside the SIM card, anti-static measures need to be taken during the production process to avoid damage to the components caused by static electricity.